Silicon Photonic Technology Overview

Silicon photonics is a key technology that creates fine optical waveguide structures in silicon and integrates devices with various functions into one small chip. This makes it possible to achieve ultra-miniaturization and low power consumption in high-speed optical devices.

In silicon photonics, optical amplification and laser diodes are key technical capabilities, because it is not possible to achieve this in silicon-based material. Therefore, a new integrated silicon photonic chip on which III-V compound semiconductors are flip-chip bonded is expected to be a technological breakthrough.

Constraints

• III-V compound semiconductors such as optical amplifiers and laser beam generators (semiconductor optical amplifiers, laser diodes, photo diode, and so on)
• Die bonding on silicon mounting substrate (or carrier) with AuSn bump formed thereon
• Failure analysis and improving the conditions of bump junctions of III-V compound semiconductors such as lasers and semiconductor optical amplifiers.

Solution will have the following capability:

1. Optimization of bump structure and bonding conditions suitable for mass production.
2. Sufficient reliability testing to ensure long-term reliability of bump junction and III-V compound semiconductors which are flip-chip bonded on silicon chips.

Possible Solution Areas

• EMS company focusing on optical device products such as semiconductor lasers.
• Equipment manufacturers of high-precision flip-chip bonders
• MEMS foundry

Top Assignees

INPHI CORP

About

INPHI Corporation is an American company that produces 10G-800G high-speed analog and mixed-signal semiconductor components and optical subsystems to networking original equipment manufacturers, optical module, cloud and telecom service providers.

Solutions

• The reference US10924269B1 addresses the limitations of traditional communication systems by introducing a compact optical transceiver based on silicon photonics for storing cryptocurrency and facilitating secure transactions.
• The reference US9651751B1 address the limitations of traditional communication transmission systems, such as bandwidth and transmission speed restrictions, by introducing a compact optical transceiver based on silicon photonics using hybrid multichip stacking without wire bonds.
• The reference US2022123518A1 addresses the need for improved techniques in bonding a laser chip to a silicon photonics chip for optical communication applications.

Advantages

• The reference US10924269B1 offers a more cost-effective and scalable solution for high-speed optical transceivers.
• The reference US9651751B1 offers a more practical and cost-effective solution for achieving advanced integration of electronics and photonics in high-speed optical transceivers.
• The reference US2022123518A1 provides enhanced 3D passive alignment precision and tolerance between the laser chip and the silicon photonics chip.

Note

• The reference US10924269B1 claimed an optical module for communicating a peer to peer transaction to transmit cryptocurrency.
• The reference US9651751B1 claimed an optical transceiver by hybrid multichip integration comprising: a Si-photonics chip attached on a PCB.
• The reference US2022123518A1 claimed a laser chip for flip-chip bonding on a silicon photonics chip with 3D passive alignment features.

SEIKO EPSON CORP

About

Seiko Epson Corporation, commonly known as Epson, is a Japanese multinational electronics company and one of the world's largest manufacturers of printers and information- and imaging-related equipment.

Solutions

• The reference US7843985B2 describes a light chip and an optical module that aim to solve the problem of distortion and damage that may occur during the bonding process of a light chip. The solution proposes a method where a vertical cavity surface emitting laser and a sub mount are bonded with a smaller load, reducing the risk of damage and improving the reliability of the light chip.
• The reference JP2005203465A provide a bump arrangement method in flip chip connection, a semiconductor chip and an optical module by which the semiconductor chip can be prevented from being broken during pressurizing in the flip chip connection.
• The reference JP2006351771A1 provide a highly reliable optical chip and optical module.

Advantages

• The reference US7843985B2 offers the unique design of the light chip and the optical module reduces the risk of distortion and damage during bonding, improving the overall reliability of the components.
• The reference JP2005203465A offers, by utilizing polygonal bump arrangements, the semiconductor chip can be connected to the wiring board with high yield and reliability, minimizing the risk of breakage during the connection process.
• The reference JP2006351771A1 provides the optical chip and module, offer enhanced reliability and durability.

Note

• The reference US7843985B2 claimed a light chip having an optical element formed on a first substrate.
• The reference JP2005203465A claimed a method of arranging bumps when a semiconductor chip having a semiconductor element formed on a compound semiconductor substrate.
• The reference JP2006351771A1 claimed an optical chip having an optical element formed on a first substrate and a resonator having an emission surface on the upper surface.

CIENA CORP

About

Ciena Corporation is an American networking systems and software company that develops and markets equipment, software and services, primarily for the telecommunications industry and large cloud service firms. Their products and services support the transport and management of voice and data traffic on communications networks.

Solutions

• The reference US10811279B2 addresses the need for a reliable method of assembling silicon photonics chips in high operational speed applications, particularly in a configuration where the chip is connected to a substrate with dissimilar thermal expansion coefficients. The solution introduces a structure with topology discontinuities on the surfaces of adjacent layers, outside sensitive regions, to limit the flow of adhesive underfill material.
• The reference US11480745B2 addresses the challenge of integrating different types of chips into a common package, specifically focusing on companion and host chip photonic integration. The solution involves forming two or more waveguides in an integrated circuit wafer, creating a cavity in the wafer, and securing a die with a photonic integrated circuit within the cavity.

Advantages

• The reference US10811279B2 offers significant advantages. By utilizing topology discontinuities and adhesive underfill material, the invention provides a reliable and cost-effective solution for assembling silicon photonics chips in high operational speed applications. 
• The reference US11480745B2 includes optimized fabrication methods for companion dies in dedicated foundries, independent fabrication for host dies before and after integration, and the ability to use different materials and processing technologies for each die without material issues between foundries. 

Note

• The reference US7843985B2 claimed a flip-chip structure utilizing two adjacent layers which are a first layer and a second layer.
• The reference US11480745B2 claimed  an article of manufacture comprising at least a portion of an integrated circuit wafer. 

FUJITSU LTD

About

Fujitsu Limited is a Japanese multinational information and communications technology equipment and services corporation, established in 1935 and headquartered in Kawasaki, Kanagawa.

Solutions

• The reference US7453058B2 addresses the challenges associated with optically coupling optoelectronic components in the field of interconnecting semiconductor devices. With the growing demand for optical networks capable of handling high voice and data signal transfers, there is a need to effectively interface optical and electrical components within these networks. The solution involves arranging optical components and optoelectronic components in a configuration that facilitates optical and electrical interconnection.
• The reference US9235001B2 focuses on solving the problem of connecting an optical integrated circuit chip and an electronic circuit chip in an optical device in a cost-effective and efficient manner. To address these challenges, proposes an optical device that includes an optical integrated circuit chip, an electronic circuit chip, and a through wiring board.

Advantages

• The reference US7453058B2 offers advantages such as reduced optical losses due to beam divergence, improved stability and reliability of the optical interface, and cost-effectiveness in creating transmission configurations.
• The reference US9235001B2 includes the ability to achieve high integration and reliable operation of multiple optical devices through a more efficient and cost-effective connection process. By eliminating the need for bonding wires and simplifying the mounting process on a circuit board, the invention enables mass production of optical systems that include drivers and inexpensive optical devices.

Note

• The reference US7453058B2 claimed an apparatus comprising a substrate having a first surface including at least one first optically active area.
• The reference US9235001B2 claimed an optical device comprises an optical integrated circuit chip.

UNITED MICROELECTRONIC CENTER CO LTD

About

United Microelectronics Centre (Hong Kong) Limited is an advanced research centre dedicated to accelerating the advancement of AI chips, systems and 5G applications. By exploring the true potential of AI hardware-algorithm co-design, computing performance and energy efficiency are improved significantly, which provide a solid foundation for the next-generation edge AI applications.

Solutions

• The reference WO2021196576A1 addresses the issue of low coupling accuracy and high packaging costs in the integration of laser chips with optoelectronic chips. Previous methods involved direct bonding of the laser chip to the optoelectronic chip, leading to challenges in fixing, heat dissipation, and alignment. The solution proposes a coupling alignment device and method that involves aligning and contacting the laser chip and optoelectronic chip with a transfer mold, transferring the laser chip to an accommodating chamber of the optoelectronic chip, and completing the transfer package.
• The reference CN110082862B addresses the issue of low efficiency and high cost in aligning and coupling a laser chip with a silicon-based sub-chip. The solution introduces a device and method for aligning and coupling a laser chip with a silicon-based sub-chip by improving the design and connection structure to an adapter plate.

Advantages

• The reference WO2021196576A1 offers higher coupling accuracy, lower packaging costs, and improved efficiency in the integration of laser chips with optoelectronic chips.
• The reference CN110082862B discloses, by utilizing the pin board with a simple structure achieves precise auto registration of the laser chip and silicon-based sub-chip, completing the connection process using mature techniques.

Note

• The reference WO2021196576A1 claimed a coupling alignment device for a laser chip and a silicon-based optoelectronic chip.
• The reference CN110082862B claimed a coupling alignment device of a laser chip and a silicon-based optoelectronic chip.

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